Opening

This session consists of rapid-fire, one-minute introductions from around sixteen exhibitors presenting their products and booth locations at ISC. The pitches collectively illustrate current industry priorities: liquid cooling and thermal management feature heavily, with Eisele presenting connectors and couplings for liquid-cooled data centers, Cooltech showing CDUs, cold plates, and fluid distribution lines, and Danfoss Power Solutions covering hoses, fittings, and dry-break couplings for coolant transport. Penn Engineering describes high-tensile fasteners and busbar connections for increasingly heavy, power-dense racks. On the computing side, Alice & Bob presents fault-tolerant quantum computing based on cat qubits designed to integrate with HPC data centers, Semidynamics describes European AI inference silicon, and Spectral Compute pitches Scale, a compiler toolchain that runs existing CUDA code on non-NVIDIA GPUs. Software and infrastructure vendors include OpenNebula Systems with a vendor-neutral control plane for AI factories, ClearML with an AI management and GPU orchestration platform, MinIO with S3-compatible object storage targeting large-scale GPU inferencing, and Lael, an Estonian company building a distributed parallel file system for the exabyte era. Hardware and storage pitches come from Inventec (server design and manufacturing), QNAP (cost-effective high-availability clusters for SMBs), Memblaze (enterprise SSDs), AsterFusion (SONiC-based AI network switches with RoCE fabrics), and Hyperstack (European AI cloud provider). The moderator notes the striking number of cooling companies as a sign of the times.